@article{article, title  = {{Microstructure and mechanical properties of Cu joints soldered with a Sn-based composite solder, reinforced by metal foam}},

 publisher = {{Elsevier BV}},

 url = {{}},

 year = {{2020}},

 month = {{12}},

 author = {{He H and Huang S and Ye Y and Xiao Y and Zhang Z and Li M and Goodall R}},

 doi = {{10.1016/j.jallcom.2020.156240}},

 volume = {{845}},

 journal = {{Journal of Alloys and Compounds}},

 note = {{Accessed on 2024/12/26}}}