@article{article, title  = {{Diffusion reaction-induced microstructure and strength evolution of Cu joints bonded with Sn-based solder containing Ni-foam}},

 publisher = {{Elsevier BV}},

 url = {{}},

 year = {{2020}},

 month = {{12}},

 author = {{He H and Huang S and Xiao Y and Goodall R}},

 doi = {{10.1016/j.matlet.2020.128642}},

 volume = {{281}},

 journal = {{Materials Letters}},

 note = {{Accessed on 2024/10/24}}}