TY  - JOUR

T1  - The thermal stability of alkanethiol self-assembled monolayers on copper for fluxless soldering applications

JO  - IEEE Transactions on Components and Packaging Technologies

PY  - 2010/01/01

AU  - Ebbens S

AU  - Hutt D

AU  - Liu C

ED  - 

DO  - DOI: 10.1109/TCAPT.2010.2041779

VL  - 33

IS  - 2

SP  - 251

EP  - 259

Y2  - 2024/12/26

ER  -