@article{article, title  = {{Effect of temperature and storage environment on the preservation of copper surfaces for fluxless soldering}},

 url = {{}},

 year = {{2006}},

 month = {{1}},

 author = {{Ebbens S and Hutt DA and Liu C}},

 doi = {{10.1109/ECTC.2006.1645911}},

 volume = {{2006}},

 journal = {{Proceedings - Electronic Components and Technology Conference}},

 pages = {{1847-1852}},

 note = {{Accessed on 2024/12/26}}}