TY  - CONF

T1  - Thermal stability of self-assembled monolayer copper preservatives for fluxless soldering

JO  - ESTC 2006: 1st Electronics Systemintegration Technology Conference, Vols 1 and 2, Proceedings

PY  - 2006/01/01

AU  - Ebbens SJ

AU  - Hutt DA

AU  - Liu CQ

ED  - 

SP  - 1360

EP  - 1366

Y2  - 2024/12/26

ER  -