TY  - JOUR

T1  - Copper conductive adhesives for printed circuit interconnects

JO  - Proceedings - Electronic Components and Technology Conference

PY  - 2012/01/01

AU  - Qi S

AU  - Litchfield R

AU  - Hutt DA

AU  - Vaidhyanathan B

AU  - Liu C

AU  - Webb P

AU  - Ebbens S

ED  - 

DO  - DOI: 10.1109/ECTC.2012.6249059

SP  - 1651

EP  - 1655

Y2  - 2024/12/26

ER  -