@article{article, title  = {{Design and evaluation of an epoxy three-dimensional multichip module}},

 url = {{}},

 year = {{1996}},

 month = {{2}},

 author = {{Stern JM and Larcombe SP and Ivey PA and Seed L and Shelley AJ and Goodenough NJ}},

 volume = {{19}},

 journal = {{IEEE T COMPON PACK B}},

 issue = {{1}},

 pages = {{188-194}},

 note = {{Accessed on 2024/12/26}}}